1-适用于大型板的完整解决方案
2-更强的缺陷验证的检测结果
3-通过V-ONE实现智能工厂的M2M链接功能
4-获得知名一级CM和OEM强力推荐
5-广泛用于汽车电子、服务器主板、医疗电子、航空航天等PCBA的X光在线检测
| Allowable Panel Characteristics | V810i S2EX | V810i S2 XXL | V810i S2 XLT |
|---|---|---|---|
| PCB最大尺寸 | 482 mm x 610 mm (19"x24") | 660 mm x 965 mm (26"x38") | 660 mm x 965 mm (26"x38") |
| PCB最小尺寸 | 76 mm x 76 mm (3" x 3" ) | 76 mm x 76 mm (3" x 3" ) | 76 mm x 76 mm (3" x 3" ) |
| 最大可测板宽 | 474 mm x 610 mm (18.7"x24") | 654 mm x 965 mm (25.75"x38") | 654 mm x 965 mm (25.75"x38") |
| 最大板厚 | 7 mm (276 mils) | 12.7 mm (500 mils) | 12.7 mm (500 mils) |
| 最小板厚 | 0.5 mm (20 mils) | 0.5 mm (20 mils) | 0.5 mm (20 mils) |
| 板弯 | Downside < 3.3 mm; Upside < 1.5 mm | Downside < 3.3 mm; Upside < 3.3 mm | Downside < 3.3 mm; Upside < 3.3 mm |
| 最大板重 | 4.5kg | 15kg | 15kg |
| 50 mm @ 23 µm resolution | 25 mm @ 19 µm resolution | 50 mm @ 19 µm resolution | |
| 38 mm @ 19 µm resolution | 15 mm @ 13 µm resolution | 31 mm @ 15 µm resolution | |
| 上部分辨率 | 38 mm @ 10.5 µm# resolution | * Calculated from Board Top surface | 13 mm @ 11 µm resolution |
| 11 mm @ 11 µm resolution | 31 mm @ 10 µm resolution | ||
| 11 mm @ 6 µm# resolution | 13 mm @ 7.5 µm resolution | ||
| * Calculated from Board Top surface | * Calculated from Board Top surface | ||
| 下部间隙 | 70 mm | 80 mm | 80 mm |
| 板边间隙 | 3 mm | 3 mm | 3 mm |
| 电路板宽度误差 | ±0.7 mm | ±0.7 mm | ±0.7 mm |
| 系统分辨率 | 23 µm/19 µm#, 11 µm, 10.5µm, 6µm# | 19 µm/13 µm | 19 µm/15 µm /11 µm/10µm/7.5 µm |
| 100% 压合件测试能力 | Yes (With PSP2 feature) | Yes (With PSP2 feature) | Yes (With PSP2 feature) |
| 可承受PCB温度 | 40 ℃ | 40 ℃ | 40 ℃ |
| Power and Environmental | |||
| 长*深*高 | 1566 mm x 2145 mm x 1972 mm | 2240 mm x 2460 mm x 1980 mm | 2240 mm x 2460 mm x 1980 mm |
| 重量 | ~3500 kg | ~5500 kg | ~6000 kg |
